Capabilities

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  • Gerber CAD data acceptable via e-mail, floppy disk & CD
  • Artwork generation via Gerber with EIE RP362-DL
  • Dual-Auto Loader Raster Photoplotter
  • Multiline Semi-Automatic Film Punch
  • Post-etch punching of CAD generated artwork and layers
  • Dryfilm Imaging
  • Automatic Optical Inspection (AOI) on 3 Camtek Orion 604 WRs
  • Vacuum assisted lamination with separate cold press
  • Drilling with complete electronic programming functions and hole checker inspection
  • Plasma Etch
  • Potassium Permanganate desmear system
  • Electroless cuposit line
  • Eductor Electroplating System
  • Tin Lead Hot-Air-Leveling (Hot-Air Solder Leveling - HASL)
  • Electroless Gold, Immersion Gold, Hard and Soft
  • Gold (full body), Immersion Silver, Immersion Tin, OSP and Carbon Paste
  • Liquid Photoimageable Soldermask (LPI Mask)
  • FR-4 Laminate (RoHS Compliant)
  • High Temp Tg
  • FR-4 Getek Laminate
  • Rogers type 4003, 4350
  • Nelco N4000-13
  Panel Size 18"x24" max.
  Overall Thickness
 .005 -.250" max.
  Number of Layers
 20 max.
  Line/Width Spacing
 .004" min. (inner/outer layer)
  Drilled Hole Size
 .006" min.
  Innerlayer Core Thickness
 .003" min.
  Copper Weight
 .25 - 8 oz. max.
  • ITAR Registered
  • MIL-PRF-55110 F with Etchback approved for both GFN & GIN materials
  • ISO 9001 Registered
  • IPC-A-600 Quality and Manufacturing Standard
  • UL Approval Rating 94V-0
  • Polar Instruments TDR for Impedance Control
  • ATG A5 Flying Probe Test System
  • 3 New System Flying Grid Tester Model S24-25 Net List testing
  • Electrical continuity testing on Fastek Models 110 and 160
  • Statistical Process Control (SPC)MIL-C-45662 equipment calibration system
  • Microsection preparation and evaluation (full group 'A' testing)